Pentru Laptop Cip Intel 50 buc /set Bga Reballing Stencil Tample Kit

35.40lei Livrare gratuita

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Descriere

  • Numărul De Model: bga reballing

pentru Laptop Cip Intel 50 buc /set Bga Reballing Stencil Tample KitPackage interior:

50x bga stencil

Mai jos sunt modele stencil:

Intel 49pcs Căldură Directă BGA Reballing Stencil

Intel:AM82801IUX

Intel:AC80566/533

Intel:AC82GS45 SLB92 E26593

Intel:AF82US15W SLGFQ

Intel:BD82HM55

Intel:BDHM65

Intel:BD82P55

Intel:BD82H61

Intel:core I7-620 de milioane de

Intel:E20810

Intel:AC82GM45//82PM45//82GL40//AC88CTPM

Intel:AC82P45//AC82P43

Intel:LE82965//82P965//82P31

Intel:QG82945P//82945GC

Intel:QG945GM//QG945PM

Intel:LE82PM965//GM965

Intel:QG82945GMS

Intel:QG82915GMS

Intel:PROCESOR:N475

Intel:LGA1156

Intel:LGA1155

Intel:82801HB

Intel:82801BA

Intel:AC82X38

Intel:IGA1366

Intel:989CPU

Intel:RC82540EM

Intel:AC82X58

Intel:N270-1.60 GHZ/512/533 N270//SLB73//AU80586GE025D

Intel:82801GBM//82801GR//82801GB// NH82801GHM

Intel:82801HBM//82801IBM//NH82801HEM

Intel:82801IB//82801IR//82801IO

Intel:82801FBM

Intel:QG82915P //NG82915G

Intel:QG82915PM//GM

Intel:RG82865PE

Intel:QG500P

Intel:775CPU

Intel:FW82815EP

Intel:RG82875

Intel:M1671

Intel:845GL//845GV

Intel:855GME//855GM

Intel:82801DBM//82801DB

Intel:82801EB

Intel:82801AA

Intel:478

Intel:479// LE80539//SL6F5

Intel:RG845MP//855PM

Intel:754CPU

pachet

  • Greutate Pachet: 0.2kg (0.44lb.)
  • Tip De Unitate: bucata
  • Dimensiunea Pachetului: 10cm x 10cm x 10cm (3.94in x 3.94in x 3.94in)
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Rating: 5 out of 5 (2 votes)

5
Amanda Oakley100 2018-03-13

all whole. good quality.

5
Ecylrgerge1 2017-11-14

good seller thank you match the description

Adaugă o recenzie

Rating